JOINING JAPAN - ADHESION & JOINING EXPO - OSAKA will be held 2025/05/01, at the Intex Osaka in Osaka (Japan). International Trade Fair for Adhesive & Joining Technologies. JOINING JAPAN - ADHESION & JOINING EXPO showcases Adhesive Agents, Adhesive Films, Tapes, Joining Equipment & Technologies, Surface Processing Device, Testing, Measurement & Analysis Technolog The following is the detailed information of this exhibition. Since the exhibition time may change, please be sure to confirm it before participating.