IC & SENSOR PACKAGING EXPO JAPAN - OSAKA

IC & SENSOR PACKAGING EXPO JAPAN - OSAKA will be held 2025/05/01， at the Intex Osaka in Osaka (Japan). Asia’s Leading Exhibition for IC Final Manufacturing gathering Advanced Equipment, Materials and Services. Assembly Equipment, Packaging Materials / Equipment, Analysis/Simulation Software for IC Packaging... The following is the detailed information of this exhibition. Since the exhibition time may change, please be sure to confirm it before participating.