Home>2025>May>IC & SENSOR PACKAGING EXPO JAPAN - OSAKA 2025

IC & SENSOR PACKAGING EXPO JAPAN - OSAKA 2025

IC & SENSOR PACKAGING EXPO JAPAN - OSAKA 2025 will be held 2025/05/14， at the Intex Osaka in Osaka (Japan). DescriptionAsia’s Leading Exhibition for IC Final Manufacturing gathering Advanced Equipment, Materials and Services. Assembly Equipment, Packaging Materials / Equipment, Analysis/Simulation Software for IC Packaging... The following is the detailed information of this exhibition. Since the exhibition time may change, please be sure to confirm it before participating.

  • CityOsaka (Japan)
  • Date2025-05-14
  • Related industriesElectronic Design & Components。Measurement, Control & Testing。
  • VenueIntex Osaka
  • Organizers(s)RX Japan/RX Global Events/
  • AudienceTrade Public
  • Cycleonce a year
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